Memory/Storage 
Winbond 300mm fab equipped with Mattson production tools
Keywords: multiple helios rtp aspen iii icpht strip systems 300mm dram
[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->Winbond Electronics Corp. has purchased advanced process equipment from Mattson Technology Inc. The equipment--a multiple Helios RTP, an Aspen III ICPHT and strip systems--were installed at Winbond's 300mm fab in Taichung, Taiwan.The systems will be used to produce DRAMs, mobile ram and flash memory......Please login or register with us to view this article>>
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