EDA/IP 
Water-filled wafers streamline chip cooling
Keywords: microelectronics advanced research corp. chip cooling water-filled wafer self-cooling pcb flip-chip-mounted ic
[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->Georgia Institute of Technology researchers have developed a chip-cooling process that they hope will replace the bulky, bolt-on metal towers used with microprocessors like the G5. Instead of an entire tower through which water circulates, they have created water-filled wafers that can be integrated......Please login or register with us to view this article>>
|
Not yet registered?
 Register FREE to view unlimited features, tutorials and products, and enable any content alert service! |
Registered already? Login to view complete content.
|
Article Comments - Water-filled wafers streamline chip ...
Visitor0530
(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist
All I want for Christmas is anything on this year's Best of Innovations Design and Engineering Award list!
Search EE Times Asia
Peek at Hot Gadgets for 2012
