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Manufacturing/Packaging  

Leica system cuts ownership cost of semiconductor manufacturers

Posted: 29 Jul 2005  Print Version  Bookmark and Share Subscribe

Keywords: leica Microsystems  lds3300 c  fab 

[Summary of tips] BROKEN_TABLE_ HIDDEN_END --> BROKEN_PICTURE_ HIDDEN_END -->The new LDS3300 C from Leica Microsystems complements its LDS series by an innovative system, combining micro and macro defect detection at simultaneous use for all 300mm wafer applications.According to the press release, the macro module of the Leica LDS3300 C system ......
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