Global Sources
EE Times-Asia
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Catch the latest   Vital Signs     Tech Watch     In Asia
EE Times-Asia > T&M
 
 
T&M  

STATS ChipPAC to build new China plant

Posted: 28 Jul 2005  Print Version  Bookmark and Share Subscribe

Keywords: pc computing  consumer  broadband  testing facility 

[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->Seeking to meet exploding demand in a hot market, Singapore's STATS ChipPAC Ltd plans to build its second chip assembly and test facility in Shanghai, China.A new 300,000-square-foot facility will be built next to STATS ChipPAC's existing 430,000-square-foot facility in the Qingpu District of Shangh......
Please login or register with us to view this article>>
 
 

Amkor, STATS ChipPAC still spilling ...
Elpida leads wafer testing venture
Article Comments - STATS ChipPAC to build new China pla...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top