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Futuristic interconnects for ICs proposed
Keywords: interconnect iitc air gap bonding nanotubes
[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->At the IEEE International Interconnect Technology Conference (IITC), researchers presented several futuristic technologies to solve the interconnect bottleneck in chip design.Activated bonding, air gap, carbon nanotubes, molecular wires, optical interconnects and spin-wave buses were among the techn......Please login or register with us to view this article>>
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