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Futuristic interconnects for ICs proposed

Posted: 18 Jul 2005     Print Version  Bookmark and Share

Keywords:interconnect  iitc  air gap  bonding  nanotubes 

[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->At the IEEE International Interconnect Technology Conference (IITC), researchers presented several futuristic technologies to solve the interconnect bottleneck in chip design.Activated bonding, air gap, carbon nanotubes, molecular wires, optical interconnects and spin-wave buses were among the techn......
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