Manufacturing/Packaging 
STATS ChipPAC to offer 300mm electroplated wafer bumping services
Keywords: stats chippac electroplated wafer bumping service wafer electroplating
[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications. Additionally, the company disclosed that it has expanded solder alloy choices for its current flip chip......Please login or register with us to view this article>>
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