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Philips Semiconductor CTO outlines system-in-package challenges

Posted: 17 May 2005  Print Version  Bookmark and Share Subscribe

Keywords: system-in-package  sip  eda tool  cmos 

[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->The next step forward in integration has to address system-in-package (SIP) issues and needs EDA tools with broader scope and greater standardization of approach, according to Rene Penning de Vries, chief technology officer of Philips Semiconductors.During keynote speech given to a two-day conferenc......
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