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Memory/Storage

Tezzaron, PICC to collaborate on 3D flash memory

Posted: 11 May 2005  Print Version  Bookmark and Share Subscribe

Keywords: programmable integrated circuit  flash memory components  three-dimensional 

[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->Tezzaron Semiconductor Inc. and startup Programmable Integrated Circuit Co. (PICC) announced plans to collaborate on the creation of three-dimensional (3D) flash memory components.Under the terms, PICC will license Tezzaron's technology to develop 3D-based flash-memory devices. PICC claims that thes......
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