T&M 
Readers weigh in on package woes
Keywords: fpga ic packages
[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->After last month's column ("The cost of packaging defects," Oct. 11, page 47), I received a number of e-mails and phone calls from users. The problems I had identified are more widespread than I suspected, and engineers were glad to see them brought out in a public forum.The comments centered on pac......Please login or register with us to view this article>>
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