T&M 
Hitachi Chemical obtains patent for IC mount assembly tape
Keywords: ic packaging mount quad flat non-leaded package quad flat package
[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->Hitachi Chemical Co. Ltd has acquired a basic patent for assembly tape used for its quad flat non-leaded package (QFN) method, a type of IC packaging mount. The QFN method was able to achieve a substantial decrease in the mounting area by storing external input/output leads on the rear of the packag......Please login or register with us to view this article>>
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