Processors/DSPs 
TI, Commit enable next-gen chips for China's 3G market
Keywords: texas instruments commit 3g wireless td-scdma chipset omap multimedia processors
[Summary of tips] BROKEN_TABLE_ HIDDEN_END -->Texas Instruments Inc. and Commit Inc. are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customized for supporting complex 3G applications. The TI and Commit solution incorporates TI's OMAP multimedia processors and d......Please login or register with us to view this article>>
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