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Hitachi Chemical acquires resist materials patent
Keywords: hitachi chemical ic package semi-additive method
[Summary of tips] Hitachi Chemical Co. Ltd has acquired a basic patent regarding resist materials for manufacturing IC package substrates. The patent specifies the structure of photosensitive resin compositions in a resist material and parameters, such as the film thickness and aspect ratio (ratio of line width to film thickness) of the resist p......Please login or register with us to view this article>>
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