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EDA/IP  

Handling a storm of packaging defects

Posted: 01 Jul 2004  Print Version  Bookmark and Share Subscribe

Keywords: sonoscan  internal packaging defect  ic package storm of defect  c-sam  jedec 

[Summary of tips] The presence of internal packaging defects in IC packages can cause havoc with reliability; but acoustic micro imaging provides a way to control costs.View the PDF document for more information.
 

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