T&M 
Unitive boosts chip performance with latest tech app
Keywords: unitive ic wlcsp spun-on polymer coating
[Summary of tips] Unitive Inc. has developed a novel process of applying a new spun-on polymer coating technology that permits further reductions in the size of ICs while improving performance and enables dramatic increases in WLCSP reliability.A typical single-layer polyimide coating is often used today as a stress buffer for wire bond, flip-ch......Please login or register with us to view this article>>
|
Not yet registered?
 Register FREE to view unlimited features, tutorials and products, and enable any content alert service! |
Registered already? Login to view complete content.
|
Article Comments - Unitive boosts chip performance with...
Visitor0213
(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist
All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.
Search EE Times Asia
Peek at Hot Gadgets for 2012
