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Manufacturing/Packaging  

Zymet rolls out silica-filled encapsulant

Posted: 28 Apr 2004  Print Version  Bookmark and Share Subscribe

Keywords: zymet  bga underfill encapsulant  cn-1453  cn-1432 

[Summary of tips] Zymet Inc. has developed a new reworkable BGA underfill encapsulant that is a silica-filled version of its earlier CN-1432.With a lower coefficient of thermal expansion of 45ppm/°C compared to 70ppm/°C, the CN-1453 is suitable for more demanding applications.The company explained that unlike flip chips, BGAs are not nor......
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