Manufacturing/Packaging 
TEL test handler supports WLCSP, KGD technologies
Keywords: tokyo electron wdf do test handler wlcsp wafer level chip size package
[Summary of tips] Tokyo Electron Ltd (TEL) has announced that it will begin sales of the WDF DP, a test handler that supports the rapidly emerging packaging and test technologies WLCSP (Wafer Level Chip Size Package) and KGD (Known Good Die).According to TEL, current WLCSP and KGD process methods require the use of expensive temporary chip carri......Please login or register with us to view this article>>
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