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Manufacturing/Packaging  

Zymet underfill encapsulants eyes CSP, BGA apps

Posted: 16 Apr 2004  Print Version  Bookmark and Share Subscribe

Keywords: zymet  encapsulant  cn-1432 

[Summary of tips] Zymet Inc., a manufacturer of microelectronic and electronic adhesives and encapsulants, has developed reworkable underfill encapsulants that are designed for CSP and BGA encapsulation.The company explains that CSPs and BGAs are not normally encapsulated. However, it has been found out that mobile phones and other handheld devi......
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