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Chipbond buys Ultratech packaging lithography tool

Posted: 10 Mar 2004  Print Version  Bookmark and Share Subscribe

Keywords: chipbond technology  ultratech  saturn spectrum 3e  packaging lithography tool 

[Summary of tips] Taiwan foundry Chipbond Technology Corp. has purchased Ultratech Inc.'s Saturn Spectrum 3e advanced packaging lithography tool. Chipbond intends to use the Ultratech system to perform gold bumping on 6- and 8-inch wafers for a wide range of display-driver devices.Ultratech claims the Saturn Spectrum 3e is capable of handling mu......
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