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Toshiba package achieve thinner chips
Keywords: Toshiba multi chip package mcp
[Summary of tips] With a 1.4mm height, the Multi Chip Package (MCP) from Toshiba Corp. stacks a total of nine layers of components.It draws on the company's advances in process and mounting technology - the ability to fabricate memory chips 70µm high. The number of layers is a fifty percent improvement on the company's current six-layer MC......Please login or register with us to view this article>>
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