Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Catch the latest   Vital Signs     Tech Watch     In Asia
EE Times-Asia > T&M
 
 
T&M  

Cadence teams with startup for packaging solution

Posted: 06 Oct 2003  Print Version  Bookmark and Share Subscribe

Keywords: cadence design systems  advanced packaging engineer 3d  ape-3d  field solver  optimal 

[Summary of tips] Claiming to offer the industry's first integrated IC packaging design and signal-integrity analysis solution, Cadence Design Systems announced Advanced Packaging Engineer 3D (APE-3D), which includes a 3D field solver from startup Optimal Corp. The resulting solution, according to both companies, is both faster and more accurate......
Please login or register with us to view this article>>
 

votes:   Add to Favorites
Cadence IC package, PCB design flow ...
Maxwell rolls hermetic die-based sta...
Article Comments - Cadence teams with startup for packa...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top