Manufacturing/Packaging 
NEC semiconductor package <1mm thick
Keywords: nec nec electronics necel multi-layer thin substrate mlts
[Summary of tips] NEC Corp. and NEC Electronics Ltd. (NECEL) announced that they have developed a multi-layer thin substrate (MLTS), an ultra-thin, fine wiring substrate, as well as a semiconductor package to support it.In the fabrication of the substrate, the fine wiring layer is first formed on a metal base and then the metal base is removed. ......Please login or register with us to view this article>>
|
Not yet registered?
 Register FREE to view unlimited features, tutorials and products, and enable any content alert service! |
Registered already? Login to view complete content.
|
| Related Articles | Editor's Choice |
- NEC targets U.S., European design houses with HLS tool
- NEC, Tohoku University promote CAM-on-MRAM use
- Philips, NEC collaborate on cancer-detecting imaging systems
- NEC-WRI collaboration eyes LTE infrastructure biz
- NEC bags APCN2 submarine cable upgrade deal
- NEC, Telefonica join hands to promote cloud computing
Article Comments - NEC semiconductor package <1mm th...
Visitor0213
(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist
All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.
Search EE Times Asia
Peek at Hot Gadgets for 2012
