Manufacturing/Packaging 
EVG system ensures precise bond alignment
Keywords: ev group evg wafer evg850
[Summary of tips] The EV Group (EVG) has released the EVG850 temporary bonding and debonding system that offers advanced capabilities for reliable backside processing of thin and fragile wafers.The technology allows bonding of device wafers to sapphire, quartz or silicon carriers, and can integrate pre- and post- processing steps such as coating......Please login or register with us to view this article>>
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