Global Sources
EE Times-Asia
 
 
FPGAs/PLDs  

Using the ispPAC30 to Monitor Die Temperature in the ORCA-4 and FPSC ICs

Posted: 17 Oct 2002  Print Version  Bookmark and Share Subscribe 

Keywords:fpga temperature monitoring  fpsc temperature monitoring  ispac30  Field Programmable Gate Array  Field Programmable System Chip 

[Summary of tips] This application note describes how the ispPAC30 is suited to perform temperature monitoring in FPGAs and FPSCs.View the PDF document for more information.
 

Article Comments - Using the ispPAC30 to Monitor Die Te...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Christmas Wishlist