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Kyocera alumina multilayer package has low resistance
Keywords: alumina multilayer package ltcc package ic packaging packaging material pcb design
[Summary of tips] Kyocera Corp. has developed an alumina multilayer package that enables the use of low-resistance copper conductors for the routing patterns, and is targeted for use in the production HF module in next-generation telecommunications devices.The package combines the low-resistance and HF properties of an LTCC package with the mech......Please login or register with us to view this article>>
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