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ISSI ships MCPs in Fujitsu's FBGA technology
Keywords: multichip package mcp memory module sram nor type flash flash memory
[Summary of tips] Integrated Silicon Solution Inc. has announced the shipment of a family of stacked multichip packaged (MCP) modules that uses Fujitsu Ltd's FBGA packaging technology.The MCP modules combine ISSI's 8Mb asynchronous SRAM with Fujitsu's 32Mb or 64Mb NOR-type Flash memories in one FBGA package, and are targeted for 2.5G and 3G phon......Please login or register with us to view this article>>
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