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Allegro sensor packages eliminate air voids

Posted: 16 May 2002  Print Version  Bookmark and Share Subscribe

Keywords: se package  sg package  sh package  hall sensor packaging  hall effect sensor 

[Summary of tips] The SE, SG, and SH Hall-effect sensor packages from Allegro MicroSystems Inc. integrate a magnet and a Hall-effect IC overmolded in a single step, eliminating the presence of air voids that can problematic during potting or overmolding.The sensor packages consist of a single overmold, which holds together a samarium-cobalt magn......
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