T&M 
IRF dual-side power package proves doubly cool
Keywords: international rectifier irf mosfet fet directfet
[Summary of tips] International Rectifier's DirectFET package provides both top-side and improved bottom-side cooling for more-effective thermal management than offered by bottomless-package or leadless-type SO-8 solutions.The package in an SO-8 footprint is 0.7mm high vs. 1.75mm for the SO-8. It will essentially double the current density in hi......Please login or register with us to view this article>>
|
Not yet registered?
 Register FREE to view unlimited features, tutorials and products, and enable any content alert service! |
Registered already? Login to view complete content.
|
| Related Articles | Editor's Choice |
- International Rectifier: a linear approach
- Resurgent IT market drives International Rectifier's revenues
- International Rectifier announces new China facility
- International Rectifier's Total Dose Radiation Hardness Assurance (RHA) Test Program
- Lead Bending and Soldering Considerations for International Rectifier's Power Semiconductor Packages
- International Rectifier obtains certifications for Leominster plant
Article Comments - IRF dual-side power package proves d...
Visitor0213
(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist
All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.
Search EE Times Asia
Peek at Hot Gadgets for 2012
