Manufacturing/Packaging 
Tin-silver copper alloy to be used in consumer applications
Keywords: national electronics manufacturing initiative tin-silver-copper alloy rflow soldering consumer application
[Summary of tips] The National Electronics Manufacturing Initiative Inc. (NEMI) has reported the latest findings of its Sn3.9Ag0.6Cu lead-free assembly project during an industry forum held at the APEX conference in San Diego. The project concluded that the tin-silver-copper alloy, which is recommended for reflow soldering, is now applicable for......Please login or register with us to view this article>>
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