T&M 
TDR for characterization and modeling, Part 1
Keywords: tdr time domain reflectometry spice ibis jedec
[Summary of tips] This article is the first of two parts. Here, the author discusses the time domain reflectometry modeling. This modeling technique allows designers to obtain both lumped as well as distributed SPICE and IBIS models for package interconnect that will correlate to the physical layout of the package.View the PDF document for more ......Please login or register with us to view this article>>
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