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EDA/IP  

New developments in place-and-route

Posted: 01 Oct 2001  Print Version  Bookmark and Share Subscribe

Keywords: place-and-route  high-density chips  pwb  bga  3d boards 

[Summary of tips] New software technologies such as free angle routing and 3D placement will increasingly become part of the board designer's toolkit to handle the new hardware technologies of microvias and high-density integrated systems on a single chip.View the PDF document for more information.
 

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