Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Catch the latest   Vital Signs     Tech Watch     In Asia
EE Times-Asia > T&M
 
 
T&M  

Implementing ball attach for CSPs

Posted: 16 Jul 2001  Print Version  Bookmark and Share Subscribe

Keywords: csp  ball attach  micro bga  vai 6300  tessera 

[Summary of tips] Drawing from the experiences of the actual implementation of a ball-attach line, the authors brief readers on the vital issues of ball attachment.View the PDF document for more information.
 

votes:   Add to Favorites
Preventing flip-chip solder joint fa...
Validate EMC design rules with 3D si...
Article Comments - Implementing ball attach for CSPs
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top