Global Sources
EE Times-Asia
 Challenges & Opportunities 2011   HDTV   PCIe   HDMI   sensor   WiMAX
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Reworking CSPs, µBGAs and flip-chips

Posted: 16 Jul 2001  Print Version  Bookmark and Share Subscribe

Keywords: csp  flip chip  reflow  rework  bga 

[Summary of tips] Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective.View the PDF document for more information.
 

Article Comments - Reworking CSPs, µBGAs and flip-...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top