Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Challenges & Opportunities 2011   HDTV   PCIe   HDMI   sensor   WiMAX
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Lead-free soldering for the attachment of µBGA packages

Posted: 07 Jun 2001  Print Version  Bookmark and Share Subscribe

Keywords: tessera  bga  packaging  chip package  lead free solder 

[Summary of tips] This application note will focus on review of alternative solder alloy compositions, furnish recommendations for solder process development, and review environmental testing requirements, comparing eutectic solder to lead-free solder on a 46 I/O µBGA package.View the PDF document for more information.
 

votes:   Add to Favorites
Recommended high-volume processing o...
Handling, mounting, bonding GaAs MMI...
Article Comments - Lead-free soldering for the attachme...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top