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Manufacturing/Packaging  

Electrical characterization of packages for use with GaAs MMIC amplifiers

Posted: 05 Jun 2001  Print Version  Bookmark and Share Subscribe

Keywords: amp  tyco  directional coupler  coupler  antenna 

[Summary of tips] This application note presents a test methodology that combines the advantages of on-wafer RF probing with a TRL calibration to create a completely de-embeddable, novel "test fixture" capable of electrically characterizing most any style of package or device.View the PDF document for more information.
 

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