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Moisture effects on the soldering of plastic encapsulated devices

Posted: 29 May 2001  Print Version  Bookmark and Share Subscribe

Keywords: m a com  amp  tyco  moisture  solder 

[Summary of tips] This application note briefly describes the moisture-induced soldering failure mechanism and test procedures, and moisture sensitivities of M/A-COM's plastic-packaged semiconductors.View the PDF document for more information.
 

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