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UltraVia thin-film substrate for advanced BGA apps

Posted: 16 Jun 2001  Print Version  Bookmark and Share Subscribe

Keywords: flip chip  bga  wire bonding  fcip  via 

[Summary of tips] A reliable high-routing-density substrate is needed to meet future market requirements. Thin-film build-up substrates offer unique advantages.View the PDF document for more information.
 

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