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Amplifiers/Converters  

Cutting-edge mount down methods boost power semiconductor performance and cut system costs

Posted: 20 Apr 2001  Print Version  Bookmark and Share Subscribe

Keywords: advanced power technology  ic package  mosfet  fet  transistor 

[Summary of tips] This application note evaluates the performance of TO-264 and T-MAX plastic-packaged MOSFETs in a variety of mount down situations, both galvanically isolated and electrically hot.View the PDF document for more information.
 

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