Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Challenges & Opportunities 2011   HDTV   PCIe   HDMI   sensor   WiMAX
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Laser processing of flex

Posted: 08 May 2001  Print Version  Bookmark and Share Subscribe

Keywords: laser processing  high-density flex  vector scanning  machining  drilling 

[Summary of tips] This article explains the use lasers for machining (cutting and excising), skiving, and drilling holes during the manufacture of flexible circuits.View the PDF document for more information.
 

votes:   Add to Favorites
System integration technologies supp...
HAL levels the playing field
Article Comments - Laser processing of flex
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top