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Manufacturing/Packaging  

SERA tin evaluation for surface finish

Posted: 15 Apr 2001  Print Version  Bookmark and Share Subscribe

Keywords: sera  hasl  cob  flip chip  osp 

[Summary of tips] Technical, economic, and environmental factors are providing the impetus to find hot air solder level (HASL) alternatives for solder finishes. SERA tin evaluation provides insights into the performance of these finishes.View the PDF document for more information.
 

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