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Solder joint reliability of BGA/CSP for mobile phones

Posted: 01 Apr 2001  Print Version  Bookmark and Share Subscribe

Keywords: underfill  solder joint  board strain  bga  qfp 

[Summary of tips] A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.View the PDF document for m......
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