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Back-end copper metallization for flip chip

Posted: 01 Apr 2001  Print Version  Bookmark and Share Subscribe

Keywords: copper metallization  flip chip  interconnect  back-end processing mcm  bcb 

[Summary of tips] The IC industry's move toward the broad implementation of copper for back-end metallization is being driven by cost reduction that results from the use of an electroplating process.View the PDF document for more information.
 

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