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Manufacturing/Packaging  

Contract manufacturing and flip-chip interconnect design

Posted: 01 Jan 2001  Print Version  Bookmark and Share Subscribe

Keywords: flip chip  3d interconnect  ubm  bcb  wafer 

[Summary of tips] This technical article describes present contract manufacturers' dilemma over the entire flip-chip manufacturing process. It also describes the use of a planarizing surface which provides a uniform surface to fabricate solder interconnect structures and redistribution metallization.View the PDF document for more information.
 

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