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Manufacturing/Packaging  

Deciding how much automation is needed in die bonding

Posted: 01 Jul 2000  Print Version  Bookmark and Share Subscribe

Keywords: semiconductor equipment corporation  sec  die bonding  model 850 flip chip bonder  model 860 omni bonder 

[Summary of tips] /ARTICLES/2000JUL/2000JUL01_SMT_THA_RR_PM_TA.PDFDIE BONDINGIC Packaging2 Electronics Engineer July 2000Automationrequirements for diebonding processThe capability requirements for diebonding equipment that can handleover time a variety of area arraypackage interconnections (flip chip,chip scale) can be wide ranging.One of the p......
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