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Manufacturing/Packaging  

Controlling process parameters for flip-chip underfill

Posted: 01 Jul 2000  Print Version  Bookmark and Share Subscribe

Keywords: speedline technologies  underfill  temperature control  rotary valve  tce 

[Summary of tips] With new substrates adding new challenges to the flip-chip technology, engineers must tackle the difference in TCE between the die and the substrate in order to avoid the fracturing of outermost connectors during thermal cycling.View the PDF document for more information.
 

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