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Manufacturing/Packaging  

Design and fabrication of a high-speed multichip module

Posted: 17 Dec 1999  Print Version  Bookmark and Share Subscribe

Keywords: mcm  multichip modules  software tools  midas  wafer sharing 

[Summary of tips] This paper will report on the design and fabrication of a Multichip Module (MCM) using affordable software tools developed by the company and fabricated through the MIDAS wafer sharing brokerage service of USC/ISI.View the PDF document for more information.
 

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