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Handling gallium arsenide die

Posted: 24 Nov 1999  Print Version  Bookmark and Share Subscribe

Keywords: anadigics  die mounting  epo-tek h-20s epoxy  ablestik 84-1lmi  wire bonding 

[Summary of tips] Gallium arsenide die has physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding operations will result in a smooth prototype or production flow. This application note discusses handling, assembly procedures, visual inspe......
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