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Manufacturing/Packaging  

Mounting and handling of semiconductor devices

Posted: 12 Nov 1999  Print Version  Bookmark and Share Subscribe

Keywords: lead forming  to-220  to-202  epoxy packages  configurations 

[Summary of tips] /ARTICLES/1999NOV/1999NOV12_DH_AN.PDFTeccor Electronics, Inc. 17-1 AN1004(972) 580-7777AN1004Mounting and Handling of Semiconductor Devices17IntroductionProper mounting and handling of semiconductor devices, particu-larly those used in power applications, is an important, yet some-times overlooked, consideration in the assembly......
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