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Board assembly techniques for 0.4mm pin pitch surface mount packages

Posted: 03 Nov 1999  Print Version  Bookmark and Share Subscribe

Keywords: qsop  soic  pcb  solder deposition  fine pitch solder deposition 

[Summary of tips] This note outlines the basic board assembly operation using fine pitch packages and provides detail on each portion of the operation as it pertains specifically to packages with 0.4mm pin pitch.View the PDF document for more information.
 

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