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Correcting IC power-grid problems before tape out
Keywords: power grid ir voltage drop signoff processes
[Summary of tips] Power-grid voltage drop can adversely effect the reliability and performance of your IC designs. Given that even current signoff processes are unable to account for UDSM effects on a chip's power-grid, incorporating the Power Grid Signoff (PGS) methodology into your sign-off procedure can help you avoid needless over-design or ......Please login or register with us to view this article>>
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