Manufacturing/Packaging 
Rework BGAs for improved process yields
Keywords: rework repair bga process yield module removal
[Summary of tips] The removal and replacement of Ball Grid Array (BGA) devices requires proper equipment selection, robust process control, and proper training of staff. Rework involves the following sequence of steps: BGA module removal, BGA site preparation, sol-der paste deposition, module replacement, and reflow.View the PDF document for mor......Please login or register with us to view this article>>
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